Determining the mechanisms of dissolution and isothermal solidification kinetics during transient liquid phase bonding of commercially pure titanium using a pure copper interlayer

TY - JOUR

T1 - Determining the mechanisms of dissolution and isothermal solidification kinetics during transient liquid phase bonding of commercially pure titanium using a pure copper interlayer

AU - Tadgell, Colin A.

AU - Corbin, Stephen F.

N1 - Funding Information: The authors would like to acknowledge to financial support of the National Sciences and Engineering Research Council (NSERC) . Funding Information: The authors would like to acknowledge to financial support of the National Sciences and Engineering Research Council (NSERC). Publisher Copyright: © 2020 Elsevier Ltd

PY - 2020/9

Y1 - 2020/9

UR - http://www.scopus.com/inward/record.url?scp=85086514501&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85086514501&partnerID=8YFLogxK

U2 - 10.1016/j.mtcomm.2020.101363

DO - 10.1016/j.mtcomm.2020.101363

M3 - Article

AN - SCOPUS:85086514501

SN - 2352-4928

VL - 24

JO - Materials Today Communications

JF - Materials Today Communications

M1 - 101363

ER -