Determining the mechanisms of dissolution and isothermal solidification kinetics during transient liquid phase bonding of commercially pure titanium using a pure copper interlayer

Colin A. Tadgell, Stephen F. Corbin

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)
Original languageEnglish
Article number101363
JournalMaterials Today Communications
Volume24
DOIs
Publication statusPublished - Sept 2020

ASJC Scopus Subject Areas

  • General Materials Science
  • Mechanics of Materials
  • Materials Chemistry

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