Detection and characterization of three-dimensional interconnect bonding voids by infrared microscopy

Jonny Höglund; Zoltan Kiss; Gyorgy Nadudvari; Zsolt Kovacs; Szabolcs Velkei; Chris Moore; Victor Vartanian; Richard A. Allen

doi:10.1117/1.JMM.13.1.011208

Detection and characterization of three-dimensional interconnect bonding voids by infrared microscopy

Jonny Höglund, Zoltan Kiss, Gyorgy Nadudvari, Zsolt Kovacs, Szabolcs Velkei, Chris Moore, Victor Vartanian, Richard A. Allen

Dentistry

科研成果: 期刊稿件 › 文章 › 同行评审

5 引用（Scopus）

源语言	英语
文章编号	011208
期刊	Journal of Micro/ Nanolithography, MEMS, and MOEMS
卷	13
期	1
DOI	https://doi.org/10.1117/1.JMM.13.1.011208
出版状态	已出版 - 1月 2014

!!!ASJC Scopus Subject Areas

电子、光学与磁性材料
凝聚态物理学
机械工程
原子、分子物理与光学
电气与电子工程

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10.1117/1.JMM.13.1.011208

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title = "Detection and characterization of three-dimensional interconnect bonding voids by infrared microscopy",

keywords = "infrared, microscopy, optical inspection, optical systems",

author = "Jonny H{\"o}glund and Zoltan Kiss and Gyorgy Nadudvari and Zsolt Kovacs and Szabolcs Velkei and Chris Moore and Victor Vartanian and Allen, {Richard A.}",

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T1 - Detection and characterization of three-dimensional interconnect bonding voids by infrared microscopy

AU - Höglund, Jonny

AU - Kiss, Zoltan

AU - Nadudvari, Gyorgy

AU - Kovacs, Zsolt

AU - Velkei, Szabolcs

AU - Moore, Chris

AU - Vartanian, Victor

AU - Allen, Richard A.

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KW - optical systems

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DO - 10.1117/1.JMM.13.1.011208

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VL - 13

JO - Journal of Micro/ Nanolithography, MEMS, and MOEMS

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ER -

Detection and characterization of three-dimensional interconnect bonding voids by infrared microscopy

!!!ASJC Scopus Subject Areas

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