Detection and characterization of three-dimensional interconnect bonding voids by infrared microscopy

Jonny Höglund, Zoltan Kiss, Gyorgy Nadudvari, Zsolt Kovacs, Szabolcs Velkei, Chris Moore, Victor Vartanian, Richard A. Allen

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)
Original languageEnglish
Article number011208
JournalJournal of Micro/ Nanolithography, MEMS, and MOEMS
Volume13
Issue number1
DOIs
Publication statusPublished - Jan 2014

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Keywords

  • infrared
  • microscopy
  • optical inspection
  • optical systems

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