Measurement of thermal interface conductance at variable clamping pressures using a steady state method

Keyphrases

• Thermal Interface Materials 100%
• Clamping Pressure 100%
• Steady-state Method 100%
• Thermal Interface Conductance 100%
• Conductance 80%
• THERM 40%
• Material Characterization 20%
• Experimental Uncertainty 20%
• High Pressure 20%
• Thermal Conductance 20%
• Material Sample 20%
• Aluminum Surface 20%
• Strong Dependence 20%
• Steady-state Characterization 20%
• High Conductance 20%
• Steady-state Thermal 20%

Engineering

• Material Interface 100%
• Thermal State 25%
• Material Sample 25%
• Experimental Uncertainty 25%