Kinematic simulation of the uncut chip thickness and surface finish using a reduced set of 3D grinding wheel measurements

Andrew McDonald; Al Mokhtar O. Mohamed; Andrew Warkentin; Robert J. Bauer

doi:10.1016/j.precisioneng.2017.02.005

Kinematic simulation of the uncut chip thickness and surface finish using a reduced set of 3D grinding wheel measurements

Andrew McDonald, Al Mokhtar O. Mohamed, Andrew Warkentin, Robert J. Bauer

Instrument Development Center

科研成果: 期刊稿件 › 文章 › 同行评审

14 引用（Scopus）

源语言	英语
页（从-至）	169-178
页数	10
期刊	Precision Engineering
卷	49
DOI	https://doi.org/10.1016/j.precisioneng.2017.02.005
出版状态	已出版 - 7月 2017

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10.1016/j.precisioneng.2017.02.005

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title = "Kinematic simulation of the uncut chip thickness and surface finish using a reduced set of 3D grinding wheel measurements",

author = "Andrew McDonald and Mohamed, {Al Mokhtar O.} and Andrew Warkentin and Bauer, {Robert J.}",

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AU - Bauer, Robert J.

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JO - Precision Engineering

JF - Precision Engineering

ER -

Kinematic simulation of the uncut chip thickness and surface finish using a reduced set of 3D grinding wheel measurements

!!!ASJC Scopus Subject Areas

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