@inproceedings{c3f09f07209943158073b016351191f7,
title = "Investigation of the thermal behaviour of thin phase change material packages as a solution to temperature control in electronics",
author = "Benjamin Sponagle and Simon Maranda and Dominic Groulx",
note = "Funding Information: The authors thank Intel Corporation for their financial and technical support, along with the Natural Sciences and Engineering Research Council of Canada (NSERC), the Nova Scotia Government and the Canadian Foundation for Innovation (CFI) for further financial assistance. Publisher Copyright: Copyright {\textcopyright} 2017 ASME.; ASME 2017 Heat Transfer Summer Conference, HT 2017 ; Conference date: 09-07-2017 Through 12-07-2017",
year = "2017",
doi = "10.1115/HT2017-4801",
language = "English",
series = "ASME 2017 Heat Transfer Summer Conference, HT 2017",
publisher = "American Society of Mechanical Engineers",
booktitle = "Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems",
}