Influence of a Ni Plating Surface Preparation on Transient Liquid Phase Bonding Behaviour of Inconel 718/BNi-2

Joel M. Chapman, Stephen F. Corbin, Eric D. Moreau

科研成果: 期刊稿件文章同行评审

3 引用 (Scopus)
源语言英语
页(从-至)4800-4812
页数13
期刊Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
52
11
DOI
出版状态已出版 - 11月 2021

!!!ASJC Scopus Subject Areas

  • 凝聚态物理学
  • 材料力学
  • 金属和合金

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Chapman, J. M., Corbin, S. F., & Moreau, E. D. (2021). Influence of a Ni Plating Surface Preparation on Transient Liquid Phase Bonding Behaviour of Inconel 718/BNi-2. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 52(11), 4800-4812. https://doi.org/10.1007/s11661-021-06425-z