Crosstalk Rejection in 3-D-Stacked Interchip Communication with Blind Source Separation

Kamal El-Sankary; Tetsuya Asai; Masato Motomura; Tadahiro Kuroda

doi:10.1109/TCSII.2015.2415258

Crosstalk Rejection in 3-D-Stacked Interchip Communication with Blind Source Separation

Kamal El-Sankary, Tetsuya Asai, Masato Motomura, Tadahiro Kuroda

Materials Science

科研成果: 期刊稿件 › 文章 › 同行评审

3 引用（Scopus）

源语言	英语
文章编号	7064710
页（从-至）	726-730
页数	5
期刊	IEEE Transactions on Circuits and Systems II: Express Briefs
卷	62
期	8
DOI	https://doi.org/10.1109/TCSII.2015.2415258
出版状态	已出版 - 8月 1 2015

!!!ASJC Scopus Subject Areas

电气与电子工程

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title = "Crosstalk Rejection in 3-D-Stacked Interchip Communication with Blind Source Separation",

keywords = "Blind source separation (BSS), crosstalk rejection, interchip communication, three-dimensional (3-D) integrated circuits (ICs)",

author = "Kamal El-Sankary and Tetsuya Asai and Masato Motomura and Tadahiro Kuroda",

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KW - three-dimensional (3-D) integrated circuits (ICs)

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Crosstalk Rejection in 3-D-Stacked Interchip Communication with Blind Source Separation

!!!ASJC Scopus Subject Areas

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