Numerical study of nano-enhanced PCMS: Are they worth it?

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 1st Thermal and Fluid Engineering Summer Conference, TFESC 2015
PublisherBegell House Inc.
Pages1951-1964
Number of pages14
ISBN (Electronic)9781567004311
Publication statusPublished - 2015
Event1st Thermal and Fluid Engineering Summer Conference, TFESC 2015 - New York City, United States
Duration: Aug 9 2015Aug 12 2015

Publication series

NameProceedings of the Thermal and Fluids Engineering Summer Conference
Volume2015-August
ISSN (Electronic)2379-1748

Conference

Conference1st Thermal and Fluid Engineering Summer Conference, TFESC 2015
Country/TerritoryUnited States
CityNew York City
Period8/9/158/12/15

ASJC Scopus Subject Areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Fluid Flow and Transfer Processes
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Renewable Energy, Sustainability and the Environment

Fingerprint

Dive into the research topics of 'Numerical study of nano-enhanced PCMS: Are they worth it?'. Together they form a unique fingerprint.

Cite this