@article{68b77092d2894c0a88ebc3d0955f48ab,
title = "Measurement of thermal interface conductance at variable clamping pressures using a steady state method",
author = "Benjamin Sponagle and Dominic Groulx",
note = "Funding Information: This work was made possible with the financial and technical assistance of Raytheon Space and Airborne Systems . The authors are also grateful to the Canadian Foundation for Innovation (CFI) for the financial assistant in procuring some of the infrastructures, as well as the Natural Science and Engineering Research Council of Canada (NSERC) and Dalhousie University for their financial support. Publisher Copyright: {\textcopyright} 2015 Elsevier Ltd. All rights reserved.",
year = "2016",
month = mar,
day = "5",
doi = "10.1016/j.applthermaleng.2015.12.010",
language = "English",
volume = "96",
pages = "671--681",
journal = "Applied Thermal Engineering",
issn = "1359-4311",
publisher = "Elsevier Limited",
}