Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis

Zhaoxin Wang; Claus Leth Bak; Henrik Sorensen; Filipe Faria Da Silva; Qian Wang

doi:10.1109/iTherm54085.2022.9899628

Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis

Zhaoxin Wang, Claus Leth Bak, Henrik Sorensen, Filipe Faria Da Silva, Qian Wang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
Publisher	IEEE Computer Society
ISBN (Electronic)	9781665485036
DOIs	https://doi.org/10.1109/iTherm54085.2022.9899628
Publication status	Published - 2022
Externally published	Yes
Event	21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022 - San Diego, United States Duration: May 31 2022 → Jun 3 2022

Publication series

Name	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume	2022-May
ISSN (Print)	1936-3958

Conference

Conference	21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022
Country/Territory	United States
City	San Diego
Period	5/31/22 → 6/3/22

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Control and Systems Engineering

Keywords

High-frequency transformer
digital twin
electromagnetic-Thermal coupling
insulation
loss density
thermal stress

Access to Document

10.1109/iTherm54085.2022.9899628

Cite this

Wang, Z., Bak, C. L., Sorensen, H., Da Silva, F. F., & Wang, Q. (2022). Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis. In Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2022-May). IEEE Computer Society. https://doi.org/10.1109/iTherm54085.2022.9899628

Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis. / Wang, Zhaoxin; Bak, Claus Leth; Sorensen, Henrik et al.
Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, 2022. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2022-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, Z, Bak, CL, Sorensen, H, Da Silva, FF & Wang, Q 2022, Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis. in Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, vol. 2022-May, IEEE Computer Society, 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022, San Diego, United States, 5/31/22. https://doi.org/10.1109/iTherm54085.2022.9899628

Wang Z, Bak CL, Sorensen H, Da Silva FF, Wang Q. Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis. In Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society. 2022. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/iTherm54085.2022.9899628

Wang, Zhaoxin ; Bak, Claus Leth ; Sorensen, Henrik et al. / Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis. Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, 2022. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

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title = "Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis",

keywords = "High-frequency transformer, digital twin, electromagnetic-Thermal coupling, insulation, loss density, thermal stress",

author = "Zhaoxin Wang and Bak, {Claus Leth} and Henrik Sorensen and {Da Silva}, {Filipe Faria} and Qian Wang",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022 ; Conference date: 31-05-2022 Through 03-06-2022",

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PY - 2022

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Digital Twin Modeling and Simulation of the High-frequency Transformer Based on Electromagnetic-Thermal Coupling Analysis

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Keywords

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