Atomic visualization of the emergence of orthorhombic phase in Hf0.5Zr0.5O2ferroelectric film with in-situ rapid thermal annealing

Tianjiao Xin; Yonghui Zheng; Yan Cheng; Kai Du; Yiwei Wang; Zhaomeng Gao; Diqing Su; Yunzhe Zheng; Qilan Zhong; Cheng Liu; Rong Huang; Chungang Duan; Sannian Song; Zhitang Song; Hangbing Lyu

doi:10.1109/VLSITechnologyandCir46769.2022.9830185

Atomic visualization of the emergence of orthorhombic phase in Hf_0.5Zr_0.5O₂ferroelectric film with in-situ rapid thermal annealing

Tianjiao Xin, Yonghui Zheng, Yan Cheng, Kai Du, Yiwei Wang, Zhaomeng Gao, Diqing Su, Yunzhe Zheng, Qilan Zhong, Cheng Liu, Rong Huang, Chungang Duan, Sannian Song, Zhitang Song, Hangbing Lyu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

10 Citations (Scopus)

Original language	English
Title of host publication	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	343-344
Number of pages	2
ISBN (Electronic)	9781665497725
DOIs	https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830185
Publication status	Published - 2022
Externally published	Yes
Event	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, United States Duration: Jun 12 2022 → Jun 17 2022

Publication series

Name	Digest of Technical Papers - Symposium on VLSI Technology
Volume	2022-June
ISSN (Print)	0743-1562

Conference

Conference	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Country/Territory	United States
City	Honolulu
Period	6/12/22 → 6/17/22

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

ferroelectric
HZO film
in-situ TEM
RTA

Access to Document

10.1109/VLSITechnologyandCir46769.2022.9830185

Cite this

Xin, T., Zheng, Y., Cheng, Y., Du, K., Wang, Y., Gao, Z., Su, D., Zheng, Y., Zhong, Q., Liu, C., Huang, R., Duan, C., Song, S., Song, Z., & Lyu, H. (2022). Atomic visualization of the emergence of orthorhombic phase in Hf_0.5Zr_0.5O₂ferroelectric film with in-situ rapid thermal annealing. In 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 (pp. 343-344). (Digest of Technical Papers - Symposium on VLSI Technology; Vol. 2022-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830185

Atomic visualization of the emergence of orthorhombic phase in Hf_0.5Zr_0.5O₂ferroelectric film with in-situ rapid thermal annealing. / Xin, Tianjiao; Zheng, Yonghui; Cheng, Yan et al.
2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 343-344 (Digest of Technical Papers - Symposium on VLSI Technology; Vol. 2022-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Xin, T, Zheng, Y, Cheng, Y, Du, K, Wang, Y, Gao, Z, Su, D, Zheng, Y, Zhong, Q, Liu, C, Huang, R, Duan, C, Song, S, Song, Z & Lyu, H 2022, Atomic visualization of the emergence of orthorhombic phase in Hf_0.5Zr_0.5O₂ferroelectric film with in-situ rapid thermal annealing. in 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Digest of Technical Papers - Symposium on VLSI Technology, vol. 2022-June, Institute of Electrical and Electronics Engineers Inc., pp. 343-344, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, Honolulu, United States, 6/12/22. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830185

Xin T, Zheng Y, Cheng Y, Du K, Wang Y, Gao Z et al. Atomic visualization of the emergence of orthorhombic phase in Hf_0.5Zr_0.5O₂ferroelectric film with in-situ rapid thermal annealing. In 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 343-344. (Digest of Technical Papers - Symposium on VLSI Technology). doi: 10.1109/VLSITechnologyandCir46769.2022.9830185

Xin, Tianjiao ; Zheng, Yonghui ; Cheng, Yan et al. / Atomic visualization of the emergence of orthorhombic phase in Hf_0.5Zr_0.5O₂ferroelectric film with in-situ rapid thermal annealing. 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 343-344 (Digest of Technical Papers - Symposium on VLSI Technology).

@inproceedings{85dfd69765234897bb8038305f269a6a,

title = "Atomic visualization of the emergence of orthorhombic phase in Hf0.5Zr0.5O2ferroelectric film with in-situ rapid thermal annealing",

keywords = "ferroelectric, HZO film, in-situ TEM, RTA",

author = "Tianjiao Xin and Yonghui Zheng and Yan Cheng and Kai Du and Yiwei Wang and Zhaomeng Gao and Diqing Su and Yunzhe Zheng and Qilan Zhong and Cheng Liu and Rong Huang and Chungang Duan and Sannian Song and Zhitang Song and Hangbing Lyu",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 ; Conference date: 12-06-2022 Through 17-06-2022",

year = "2022",

doi = "10.1109/VLSITechnologyandCir46769.2022.9830185",

language = "English",

series = "Digest of Technical Papers - Symposium on VLSI Technology",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "343--344",

booktitle = "2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022",

address = "United States",

}

TY - GEN

T1 - Atomic visualization of the emergence of orthorhombic phase in Hf0.5Zr0.5O2ferroelectric film with in-situ rapid thermal annealing

AU - Xin, Tianjiao

AU - Zheng, Yonghui

AU - Cheng, Yan

AU - Du, Kai

AU - Wang, Yiwei

AU - Gao, Zhaomeng

AU - Su, Diqing

AU - Zheng, Yunzhe

AU - Zhong, Qilan

AU - Liu, Cheng

AU - Huang, Rong

AU - Duan, Chungang

AU - Song, Sannian

AU - Song, Zhitang

AU - Lyu, Hangbing

PY - 2022

Y1 - 2022

KW - ferroelectric

KW - HZO film

KW - in-situ TEM

KW - RTA

UR - http://www.scopus.com/inward/record.url?scp=85135220332&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85135220332&partnerID=8YFLogxK

U2 - 10.1109/VLSITechnologyandCir46769.2022.9830185

DO - 10.1109/VLSITechnologyandCir46769.2022.9830185

M3 - Conference contribution

AN - SCOPUS:85135220332

T3 - Digest of Technical Papers - Symposium on VLSI Technology

SP - 343

EP - 344

BT - 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022

Y2 - 12 June 2022 through 17 June 2022

ER -