An unconditional stable meshless ADI-RPIM for simulation of coupled transient electrothermal problems

Keyphrases

• Alternating Direction Implicit Method 25%
• Behavior Change 25%
• Computational Speed 25%
• Coupled Problems 25%
• Electric Potential 50%
• Electrical Devices 25%
• Electrical Parameters 25%
• Electro-thermal Problem 100%
• Electronic Components 25%
• Electronic Devices 25%
• Fictitious Point Method 25%
• Heat Loss 25%
• Heat Transfer Equation 25%
• Implicit Techniques 25%
• Joule Heat 25%
• Meshless 100%
• Meshless Approach 25%
• Multi-scale Structure 25%
• Multiphysics 25%
• Neumann Boundary Condition 25%
• Node Placement 25%
• Non-uniform Nodes 25%
• Numerical Simulation 25%
• Numerical Stability 25%
• Potential Equation 25%
• Potential Problems 25%
• Radial Point Interpolation Method 100%
• Robin Condition 25%
• Semiconductor Components 25%
• Stability Issues 25%
• Temperature Effect 25%
• Thermal Process 25%
• Thermoelectric Properties 50%
• Thin-film Resistor 25%
• Time-domain Simulation 25%
• Unconditionally Stable 100%

Engineering

• Electric Potential 50%
• Electrical Device 25%
• Film Resistor 25%
• Heat Losses 25%
• Interpolation Point 100%
• Multiscale 50%
• Neumann Boundary Condition 25%
• Nodes 25%
• Numerical Stability 25%
• Point Method 25%
• Thermal Process 25%
• Thin Films 25%
• Time Domain 50%
• Transients 100%