A novel smart adhesively bonded joint system

Jinquan Cheng; Farid Taheri

doi:10.1088/0964-1726/14/5/035

A novel smart adhesively bonded joint system

Jinquan Cheng, Farid Taheri

Mathematics

Research output: Contribution to journal › Article › peer-review

21 Citations (Scopus)

Original language	English
Pages (from-to)	971-981
Number of pages	11
Journal	Smart Materials and Structures
Volume	14
Issue number	5
DOIs	https://doi.org/10.1088/0964-1726/14/5/035
Publication status	Published - Oct 1 2005

ASJC Scopus Subject Areas

Signal Processing
Civil and Structural Engineering
Atomic and Molecular Physics, and Optics
General Materials Science
Condensed Matter Physics
Mechanics of Materials
Electrical and Electronic Engineering

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A novel smart adhesively bonded joint system

ASJC Scopus Subject Areas

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